feb.1999 mitsubishi semiconductor triac ? BCR2PM low power use insulated type, planar passivation type application switching mode power supply, light dimmer, electric flasher unit, control of household equipment such as tv sets stereo refrigerator washing machine infrared kotatsu carpet, solenoid drivers, small motor control, copying machine, electric tool, other general purpose control applications BCR2PM ] 1. gate open. outline drawing dimensions in mm to-220f type name voltage class f 3.2 0.2 1.3 max 0.8 2.54 13.5 min 3.6 5.0 1.2 8.5 10.5 max 5.2 4.5 17 2.54 2.8 0.5 2.6 a a a t 1 terminal t 2 terminal gate terminal i t (rms) ........................................................................ 2a v drm ..............................................................400v/600v i rgt ! , i rgt # ....................................................... 10ma symbol i t (rms) i tsm i 2 t p gm p g (av) v gm i gm t j t stg parameter rms on-state current surge on-state current i 2 t for fusing peak gate power dissipation average gate power dissipation peak gate voltage peak gate current junction temperature storage temperature weight conditions commercial frequency, sine full wave 360 conduction 60hz sinewave 1 full cycle, peak value, non-repetitive value corresponding to 1 cycle of half wave 60hz, surge on-state current typical value unit a a a 2 s w w v a c c g ratings 2 10 0.41 1 0.1 6 1 C40 ~ +125 C40 ~ +125 2.0 symbol v drm v dsm parameter repetitive peak off-state voltage ] 1 non-repetitive peak off-state voltage ] 1 voltage class unit v v maximum ratings 8 400 500 12 600 720
feb.1999 10 0 23 5710 1 4 2 23 5710 2 44 6 8 10 3 1 5 7 9 0 3.8 0.6 1.4 2.2 3.0 1.0 1.8 2.6 3.4 10 2 7 5 3 2 10 1 7 5 3 2 10 0 7 5 3 2 10 ? t j = 25 c maximum on-state characteristics on-state current (a) on-state voltage (v) rated surge on-state current surge on-state current (a) conduction time (cycles at 60hz) mitsubishi semiconductor triac ? BCR2PM low power use insulated type, planar passivation type ] 2. measurement using the gate trigger characteristics measurement circuit. symbol i drm v tm v rgt ! v rgt # i rgt ! i rgt # v gd r th (j-a) test conditions t j =125 c, v drm applied t a =25 c, i tm =1.5a, instantaneous measurement t j =25 c, v d =6v, r l =6 w , r g =330 w t j =25 c, v d =6v, r l =6 w , r g =330 w t j =125 c, v d =1/2v drm junction to ambient, natural convection unit ma v v v ma ma v c/w typ. @ # @ # electrical characteristics limits min. 0.1 max. 0.5 1.6 2.0 2.0 10 10 40 performance curves 6 w 6 w 6v 6v r g r g a v a v test procedure 3 test procedure 2 gate trigger characteristics test circuits parameter repetitive peak off-state current on-state voltage gate trigger voltage ] 2 gate trigger current ] 2 gate non-trigger voltage thermal resistance
feb.1999 natural convection no fins print board t = 1.6mm solder land : f 2mm 10 0 23 10 0 5710 1 23 5710 2 23 5710 3 3 2 10 1 7 5 3 2 7 5 7 5 3 2 10 ? p gm = 1w p g(av) = 0.1w i gm = 1a i rgt i, i rgt iii v gm = 6v v gd = 0.1v v gt 10 1 10 3 7 5 3 2 ?0 ?0 20 10 2 7 5 3 2 60 100 140 4 4 ?0 0 40 80 120 i rgt i , i rgt iii v rgt i v rgt iii 10 1 10 3 7 5 3 2 ?0 ?0 20 10 2 7 5 3 2 60 100 140 4 4 ?0 0 40 80 120 10 3 10 ? 10 3 10 4 10 2 7 5 3 2 10 0 7 5 3 2 10 1 7 5 3 2 7 5 3 2 10 1 23 57 23 57 10 2 10 5 23 57 23 57 natural convection no fins print board t = 1.6mm solder land : f 2mm ? ? ? 1.8 1.6 1.2 0.6 0.4 0.2 1.4 1.0 0.8 0 0.2 0.4 0.8 0.6 1.0 1.2 1.4 0 160 120 60 40 20 140 100 80 0 3.2 0 0.4 0.8 1.6 1.2 2.0 2.4 2.8 curves apply regardless of conduction angle resistive, inductive loads gate voltage (v) gate current (ma) gate trigger current vs. junction temperature junction temperature (?) gate trigger voltage vs. junction temperature junction temperature (?) gate characteristics 100 (%) gate trigger current (t j = t?) gate trigger current (t j = 25?) 100 (%) gate trigger voltage ( t j = t c ) gate trigger voltage ( t j = 25 ? ) maximum transient thermal impedance characteristics (junction to ambient) transient thermal impedance (?/ w) conduction time (cycles at 60hz) maximum on-state power dissipation on-state power dissipation (w) rms on-state current (a) allowable ambient temperature vs. rms on-state current ambient temperature (?) rms on-state current (a) typical example typical example 360 conduction resistive, inductive loads ? ? ? mitsubishi semiconductor triac ? BCR2PM low power use insulated type, planar passivation type
feb.1999 140 40 ?0 ?0 ?0 0 20 60 80 100 120 10 5 7 5 3 2 10 4 7 5 3 2 10 3 7 5 3 2 10 2 10 3 7 5 3 2 ?0 ?0 20 10 2 7 5 3 2 60 100 140 4 4 ?0 0 40 80 120 10 1 160 ?0 0 40 80 120 10 2 7 5 3 2 10 1 7 5 3 2 10 0 7 5 3 2 10 -1 160 100 80 40 20 0 140 40 ?0 ?0 ?0 0 20 60 80 140 100120 60 120 23 10 0 5710 1 23 5710 2 23 5710 3 120 0 20 40 60 80 100 140 160 t j = 125? i quadrant iii quadrant 10 1 10 3 7 5 3 2 10 0 23 5710 1 10 2 7 5 3 2 23 5710 2 4 4 44 i rgt iii i rgt i repetitive peak off-state current vs. junction temperature junction temperature (?) 100 (%) repetitive peak off-state current ( t j = t c ) repetitive peak off-state current ( t j = 25 ? ) holding current vs. junction temperature junction temperature (?) 100 (%) holding current ( t j = t c ) holding current ( t j = 25 ? ) laching current vs. junction temperature laching current (ma) junction temperature (?) breakover voltage vs. junction temperature junction temperature (?) 100 (%) breakover voltage ( t j = t c ) breakover voltage ( t j = 25 ? ) breakover voltage vs. rate of rise of off-state voltage rate of rise of off-state voltage (v/?) 100 (%) breakover voltage ( dv/dt = xv/? ) breakover voltage ( dv/dt = 1v/? ) gate trigger current vs. gate current pulse width gate current pulse width (?) 100 (%) gate trigger current ( tw ) gate trigger current ( dc ) typical example typical example typical example typical example typical example distribution t 2 + , g typical example t 2 , g typical example mitsubishi semiconductor triac ? BCR2PM low power use insulated type, planar passivation type
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